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FREE TECHNICAL SUPPORT ON ANY VAPOR PHASE LEAD FREE SOLDERING APPLICATION !!!
Lead Free Soldering refers to the technique of reflowing solder compounds that contain no lead. Driven by Market forces in Europe in 2002 (WEEE and RoHs),Lead Free Soldering in the US is finally catching up with Europe - without any legislative mandate in the US! Classically the world used SnPb alloys that reflowed at 215˚C. At those temperatures, most components were able to survive multiple passes in a process with no deleterious effects. Lead free alloys require temps in the range of 225-245˚C to reach an ideal liquidous phase. In order for all the parts in a board to reflow properly, it is not uncommon for a board to make 6 or more passes thru an air reflow oven at ever increasing temperatures - up to 265˚C!! One slick way to avoid overcooking parts on your board is to reflow using Vapor Phase Reflow (VPS) Technology.
Founded in 1996 to support the vapor reflow market, R&D Technical Services is the leading source of vapor phase equipment. R&D Technical Services’ vapor phase systems are used in numerous markets including SMT solder reflow, selective component rework, lead-free soldering, curing, drying, mechanical attachment, plastic package testing and more.
When faced with WEEE or RoHS challenges, only Vapor Phase Reflow can Address all the issues without driving the Production Manager crazy.
Lastly, Because conventional techniques require the board to be processed at temperatures in excess of 260˚C in order to reflow that certain BGA. The result is a very challenging board to clean. Because VPS is done in an inert atmosphere, the surface soils that remain after VPS reflow of Lead free solder is way easier to Clean.